A result of the collaboration of Apple, HP, Intel, Microsoft and various companies, the USB 3.0 Promoter Group, has announced USB 3.2 and its specifications.
One must agree that USB 3.2 is a huge leap from USB 3.0 and 3.1 and their limited generations as it comes with multi-lane channels for specific operations that USB 3.0 and USB 3.1 didn’t adore.A fact , USB Type-C also had multi-lane operations but here with USB 3.2 it will be much easier to create multi-lane solutions and less complex transfers between hosts or devices with two lanes with 5 Gbps and two lanes for 10 Gbps each. With USB 3.2 to USB 3.2 devices will have 2 GBps of bandwidth where USB 3.1 current gen could handle 10 Gbps. USB 3.2 will luckily be backward compatible.
Key features of the new USB 3.2 solution:
- Using existing USB Type-C cables there shall be two-lane operation.
- SuperSpeed will be continuing.
- Minor update for address fetch stability , performance and ensuring seamless transfers.
The Chairman of USB 3.0 Promoter Group has mentioned in a recent interview –
“When we introduced USB Type-C to the market, we intended to assure that USB Type-C cables and connectors certified for SuperSpeed USB or SuperSpeed USB 10 Gbps would, as produced, support higher performance USB as newer generations of USB 3.0 were developed. The USB 3.2 update delivers the next level of performance”
Still, flash storage solutions are advancing day-by-day , thanks to the usage of 64-layer protocols and higher tech from Intel,Toshiba and others which is becoming more and more fast and stable to handle RAW and 4K files.
More details are expected about the USB 3.2 during USB developers day 2017 later this year.